thanks to AI demand, Lattice cannot make enough FPGAs to fulfill orders on iCE40's (and probably ECP5's) with less than a year of lead time. this is likely to cause supply chain issues for Glasgow revD
- https://www.tomshardware.com/tech-industry/semiconductors/ai-chip-boom-sparks-bt-substrate-materials-shortage-tsmcs-huge-demand-causes-supply-disruptions-for-nand-flash-controllers-ssds
- https://www.digitimes.com/news/a20250527PD236.html
words cannot describe my contempt for this shit, and my disdain for anyone still pushing it
(there is no shortage or supply chain issues with the silicon itself. rather, the problem here is the resin used to make a part of the packaging. in theory it would be possible to just glue a die to the PCB and bond it out during assembly, in practice this would be prohibitively expensive as far as I know)
